Microscope image of electromigration-induced hillock and void

PDF] Electromigration in bamboo aluminum interconnects

PDF) In-situ scanning electron microscope observation of electromigration-induced void growth in 30 nm ½ pitch Cu interconnect structures

Electromigration Encyclopedia MDPI

Materials, Free Full-Text

Electromigration in solder joints: A cross-sectioned model system for real-time observation - ScienceDirect

Thermal Stress Characteristics and Stress-Induced Void Formation in Aluminum and Copper Interconnects (Chapter 3) - Electromigration in Metals

A Review of the Study on the Electromigration and Power Electronics

Mitigation of Electromigration in Metal Interconnects via Hexagonal Boron Nitride as an Ångström‐Thin Passivation Layer - Jeong - 2021 - Advanced Electronic Materials - Wiley Online Library

Electromigration - an overview

Hillocks and voids induced by electromigration with high current